ETEL | Top High-Dynamic Motion Technology Solutions Provider in Europe

ETEL



Precision in Every Dimension: ETEL’s Multi-Competence Approach to Performance

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Herve Stampfli, ETEL | Manufacturing Tech Insights | Top High-Dynamic Motion Technology Solutions Provider in EuropeHerve Stampfli, Head of Product Management
From semiconductor fabs to advanced electronics, motion systems remain the backbone of modern manufacturing. For OEMs, the challenge is no longer limited to a fast movement; it is now about achieving fast, accurate, and reliable performance every millisecond of every production cycle. In this environment, even the smallest disturbance, such as floor vibrations, position jittering, temperature fluctuation or contamination, can disrupt an entire process. Traditional motion setups, built from parts sourced across multiple vendors, often fall short in maintaining the tight integration required for peak performance.

That is where ETEL gains its edge.

With its Full Forward Integration (FFI) motion system—featuring optimized direct drive motors and advanced metrology—and motion control. The FFI approach ensures that every element is optimized to work together. The result is motion systems that are faster, more precise, ultra-stable and consistently reliable under real-world production pressures.

This eliminates fragmentation and accountability issues that once plagued manufacturers relying on multiple component suppliers. By unifying every part under one roof, the company enables customers to focus on their core competencies with confidence in flawless motion performance.

“The performance we deliver has a direct impact on our customers’ process yield and accuracy,” says Hervé Stämpfli, Head of Product Management. “And since we control every layer of the motion stack, we are able to meet those performance requirements very reliably.”

Motion Solutions And Advanced Control Technologies

ETEL offers a diverse portfolio of motion technologies and systems for equipment manufacturers in the semiconductor and advanced electronics industries. Under its FFI approach, every solution supports a wide range of applications, from Front-end to Back-end segments, including lithography, process control, annealing, probing, dicing, wire, die and flip-chip bonding, test handlers, and more.

“Today, the majority of our high-end motion system applications are propelled by the demands in Advanced Packaging, with heterogeneous integration playing a central role. This evolution is reshaping traditional semiconductor segmentation. Where the back-end once prioritized high throughput with moderate precision, and the front-end focused on ultra-high accuracy and cleanliness, Advanced Packaging is forging a new “mid-end” segment — one that requires all these attributes to coexist and perform together seamlessly,” says Hervé.

These applications rely on advanced motion controllers that ETEL has been developing since the 1990s. Originally focused on direct-drive motors, the company engineered its own controllers after facing a lack of suitable options on the market, ensuring precise, high-speed, and stable performance.

Today, ETEL is introducing the fourth generation of its position controllers, ACCURET+, set to launch by the end of this year. ACCURET+ belongs to a decentralized control architecture philosophy, in which computation and processing are handled directly at the axis controller level, maximizing the amount of control tasks that can be executed locally, without the need for communication with a central motion controller.

However, as motion systems become increasingly sophisticated, control tasks involving multiple axes are becoming more common—making data sharing essential. In this context, the key priority is ensuring precise synchronization of all data exchanged across the various axes.

To ensure real-time operation and jitter free synchronization, ETEL developed the TransnET communication bus—enabling fast and time-deterministic slave-to-slave communication. This architecture facilitates real-time axis-to-axis data exchange, unlocking advanced capabilities such as cross-axes feedforward, multi-degree-of-freedom control, stage mapping, advanced metrology support, active isolation, and more. TRANSNET overcomes the typical constraints of decentralized controllers while retaining their core strengths— namely, advanced control capabilities, super-fast loop closure, high bandwidth, and scalability. Leveraging a gigabit Ethernet-based digital bus, it achieves a bidirectional communication cycle time of just 50 microseconds and delivers industry-leading nanosecond-level jitter across all axes. This ensures precise metrology synchronization and significantly enhances tool-point motion performance.
  • The performance we deliver has a direct impact on our customers’ process yield and accuracy.


As a matter of fact, in advanced motion systems, many high performance are linked to how well inter-axes data exchange is handled. This becomes especially critical when the control framework includes active isolation systems or metrologies with multiple degrees of freedom.

The ACCURET+ position controller delivers high control bandwidth, ultra-low latency, and an outstanding signal-to-noise ratio—enabling both high throughput and nanometer-level position jitter. Its advanced architecture ensures exceptional accuracy through multiple position feedback inputs, while features such as encoder mapping and stage mapping provide ultra-precise control and system-wide compensation.

ACCURET+ supports a wide range of motors—including brushless, stepper, and voice coil actuators—pushing performance to its optimal limits. ACCURET+ is the world’s first controller compatible with the ENDAT3 serial interface from HEIDENHAIN, reducing cabling and interference while improving overall system performance and enabling multiple degree-of-freedom metrologies. For additional assurance, it includes STO-SIL3 functional safety certification. It provides reaction times four times faster than before and supports advanced capabilities such as precise position or time-based triggering on compensated position data, advanced filters, fifth order motion profile parameters (snap), decoupled gantry control, dynamic yaw control, flight recording, and intuitive diagnostic tools.

In parallel, ETEL has developed UltimET+, a high-performance motion controller optimized for synchronization and interpolation tasks. Featuring enhanced processing power and available in both PCIe and standalone box formats, UltimET+ is designed to meet the demands of highly dynamic and complex motion applications. Its architecture ensures precise coordination across multiple axes, making it ideal for the most demanding industrial environments.

The Innovation Legacy

Innovation has been at the core of the company from day one. Over the years, ETEL has introduced technologies such as mechanical, air, flexure and magnetic bearings combined with multi-degree-of-freedom (DOF) metrology systems. These advancements have enabled ETEL to address challenges in advanced packaging, such as the continuous reduction in interconnect dimensions and the need for sub-100 nm accuracy. For example, a one-micron interconnect pitch requires a system positioning accuracy of around 50 nanometers—previously unachievable without sacrificing throughput.

Building on this progress, a standout innovation is ETEL’s High Dynamic Range (HDR) option on its ACCURET+, which delivers ultra-low jitter (105 dB SNR) together with high power. Its long-term R&D vision is further reflected in the TELICA HP platform, which features a specific and innovative Moving Metrology Frame (MMF) specifically dedicated to the high accuracy requirements of Hybrid Bonding.

As part of the HEIDENHAIN Group, the company also leverages high-end metrology directly within its motion systems to ensure accuracy, unlike competitors who rely mainly on precision mechanical parts. By placing MultiDOF encoders close to the tool point, ETEL not only ensures superior system accuracy but also maintains this accuracy consistently over time.

Following the ongoing industry trend to move to larger substrates as a way to reduce Total Cost of Ownership, ETEL’s motion system platforms can all be stretched-out without compromising on performances: RDL lithography, Process control applications - such as Overlay, Critical Dimension, Defect Inspections-, Automated Optical Inspection, hybrid bonding and many more applications can all benefit from this sub-100 nanometer accuracy over time on panel format.

Enabling Consistent Nanometer-Level Performance Worldwide

Such precision and reliability are essential in the semiconductor industry, where downtime incurs significant costs. To support this, the company leverages HEIDENHAIN’s global sales network and local presence for responsive, on-site support. It has established Electronics Technical Competence Centers (ETCC) in key regions such as in Europe (France, Italy, Germany, the Netherlands), in Asia (China, Singapour, Japan, Taiwan, Korea), and in America (the U.S). While core development remains in Switzerland, ETEL is expanding its supply chain with an Asian manufacturing hub to accelerate system delivery, optimize operations, and further strengthen its market position.

By uniting advanced technology, global support, and seamless performance, the company drives the future of nanoscale manufacturing. In an industry where precision is measured in nanometers and TAKT time in sub-milliseconds, ETEL stands as a trusted partner in delivering high-performance motion solutions.

Deep Dive

Advancing Precision In High Dynamic Motion Systems

Manufacturers operating at the forefront of semiconductor and advanced automation face a persistent tension between throughput and precision. Interconnect geometries continue to shrink below the micrometer scale, substrates increase in size and mass, and production lines are expected to sustain nanometer- level positioning stability over extended scanning cycles. Any degradation in motion performance directly affects yield, overlay accuracy and tool availability. For executives responsible for motion technology investments, the discussion is no longer about isolated components. It centers on who can assume responsibility for performance at the point where the process occurs. In this environment, a credible motion partner must control every layer that influences dynamic behavior. Motors, bearings, feedback systems, vibration isolation, structural frames and control electronics interact continuously. A stage optimized in isolation may underperform once integrated into a machine with external vibration sources, thermal drift or suboptimal feedback placement. Sustainable throughput and accuracy depend on an architecture that aligns mechanics, metrology and control bandwidth from the outset. Precision at the tool center point has become a defining benchmark. Mechanical stiffness alone cannot guarantee sub-100 nanometer positioning during long scan sequences. Direct metrology, positioned as close as possible to the process location, offers a more reliable path to dynamic accuracy. When multi-degree-of-freedom encoders measure motion in multiple axes simultaneously, they compensate for parasitic errors that accumulate in conventional stack- ups. This approach also preserves performance as payloads increase, such as the transition from 300 mm wafers to large panel formats. Control technology now plays an equally decisive role. Direct drive architectures eliminate transmission elements, but they demand higher control bandwidth, lower latency and superior signal integrity. Executives should expect controllers capable of fast encoder processing, deterministic communication and advanced filtering to suppress noise without sacrificing responsiveness. Functional safety certification at the highest levels is also essential in high- value fabrication environments where downtime carries significant financial impact. Throughput cannot be improved at the expense of jitter. Advanced packaging applications illustrate this balance clearly. One-micron interconnect dimensions imply positioning stability an order of magnitude tighter. Achieving that level historically required limiting power output, constraining acceleration or reducing productivity. The next generation of systems must deliver nanometer- level jitter while sustaining the force and speed required for heavy substrates and rapid cycling. Thermal stability and vibration management complete the picture. Larger chucks, warped substrates and integrated unwarping mechanisms increase system mass and thermal load. Active isolation, air or magnetic bearing technologies and integrated structural design are no longer optional enhancements. They are foundational to maintaining accuracy over hours of continuous operation. Within this context, ETEL represents a compelling benchmark. It has evolved from a motor specialist into a provider of fully integrated motion systems under its Full Forward Integration approach, assuming responsibility from frame and vibration isolation through direct drive stages and proprietary control. Its latest AccurET+ platform, officially launched in 2025, increases control bandwidth, reduces latency and supports Endat3 protocol compatibility, while TransnET provides deterministic 50 μs communication. The HDR option enables nanometer- level jitter even on high-power amplifiers. For lithography and advanced packaging, its forthcoming METIS HP full air bearing platform targets 100 nm class accuracy with sustained dynamic stability. Backed by Electronics Technical Competence Centers across key semiconductor regions, ETEL offers both technological depth and local support, making it a prudent choice for executives prioritizing precision, throughput and accountability in motion performance. ...Read more
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Top High-Dynamic Motion Technology Solutions Provider in Europe - 2025

ETEL

Company
ETEL

Management
Herve Stampfli, Head of Product Management

Description
ETEL specializes in advanced motion solutions for the semiconductor industry, delivering components or fully integrated systems. As part of the HEIDENHAIN Group, it combines innovative technologies and global support to empower manufacturers in achieving nanometer-level accuracy and enhanced production efficiency.