Asia Ink Expo
Asia Ink Industry Development Conference 2025 Concludes: Policy Guidance and Technological Breakthroughs Propel Green Innovation as Industry Consensus
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Manufacturing Technology Insights | Monday, December 22, 2025
Asia Ink Industry Development Conference 2025 Concludes: Policy Guidance and Technological Breakthroughs Propel Green Innovation as Industry Consensus
On October 16, as a core supporting event of Asia Ink Expo 2025, the Asia Ink Industry Development Conference was successfully held at the conference Hall 2, Guangzhou Aerotropolise Expo Center. Focusing on green transformation and technology empowerment, the conference invited 10 policy experts, academic scholars, and corporate technical representatives to share insights—addressing both industry compliance challenges and introducing innovative application solutions, which were highly praised by attendees for their practicality.
Ⅰ.Policy Interpretation + Bio-based Innovation: Dual Engines Driving Green Transformation
The second half of the conference featured consecutive sessions on policy and material innovation, delivering dual support—"direction + pathway"—for the industry's green development.Jianjun Li, advisor to the VOCs Governance Committee of China Printing and Equipment Industries Association, opened with a presentation titled "Source Reduction Alternatives for Packaging Printing VOCs and Policy Directions," directly addressing industry pain points: "SME packaging manufacturers predominantly rely on inefficient treatment systems, with fugitive emissions accounting for 30%-40% of total VOCs. Gravure water-based ink application is key to source reduction." His integrated solution—"water-based printing + energy-efficient drying + ethanol recovery"—captivated attendees. By achieving over 85% waste heat recovery efficiency and 90% ethanol purity, this approach enables a single 10-color press to yield annual energy savings of 380,000-1.15 million RMB while reducing VOCs by 80%, truly achieving synergistic "emission reduction, decarbonization, and cost savings." Li also clarified China's 15th Five-Year Plan policy orientation: inefficient treatment systems will be phased out mandatorily, while low-VOCs material applications will receive strengthened support, drawing a clear compliance baseline for corporate transformation.
Following this presentation, Professor Wenxun Guo from the College of Materials Science and Engineering at Hunan University delivered a presentation titled "Application of Saccharides in Water-based UV Inks, Coatings, and Varnishes." He proposed using glucose syrup and whole sucrose syrup as bio-based raw materials in combination with water-based UV resins, achieving near-zero VOC emissions while imparting antimicrobial and antiviral properties to the inks. The specialized resin developed by his team demonstrated a sterilization rate exceeding 99.99% against E. coli and Staphylococcus aureus, making it suitable for sensitive applications such as children's products and medical packaging. On-site application examples further highlighted the innovation's value: textbook covers and wood varnish samples made with this material achieved a gloss level of over 102 degrees, effectively balancing environmental sustainability with aesthetic quality and opening a new pathway of "bio-based + functionalization" for the ink industry.
Ⅱ.Digital Inks Break New Ground, Unlocking Novel Possibilities for Industrial Applications
While discussions on green transformation focused on "industry responsibility," the session on "Innovative Applications of Digital Inks" presented by Lihai Feng, Digital Technology Service Engineer at MARABU China, revealed new "market growth potential" in the ink industry for attendees.
Lihai Feng challenged conventional perceptions with a series of industrial-grade case studies: The Ultra Jet DUV-C series UV inks can achieve 3mm thick embossed printing, enabling direct printing of three-dimensional brand logos on wine bottles and even adapting to aircraft fuselage applications. For the automotive sector, his "digital + screen printing" hybrid solution allows precise pattern printing on PC films, which—when overlayed with silk screen-printed layers—had passed the rigorous forming and delamination tests, meeting the demands of IML (In-Mold Labeling) processes. "I previously thought digital inks were only suitable for small-batch customization, but now I see their applicability in high-end manufacturing sectors like automotive and aerospace," sighed a packaging printing company executive among the audience. Feng also highlighted that these digital inks offer precise compatibility with various printhead models while balancing adhesion and scratch resistance, providing technical support for ink manufacturers to expand their business boundaries.
Ⅲ.The tightly-packed agenda delivered tangible outcomes, effectively building bridges for industrial collaboration.
The morning sessions focused on technical specifics, while the afternoon program expanded to cover policies, materials, and cutting-edge applications. The strategically placed lunch and coffee breaks became "golden hours" for participants to engage deeply with speakers—clusters of attendees gathered around Jianjun Li to discuss regional policy variations, consulted Wenxun Guo on cost adaptability of bio-based materials, and explored equipment compatibility for digital inks with Lihai Feng, maintaining vibrant discussions throughout the venue.
The value of this conference extends far beyond mere "information dissemination": it created alignment points where regulatory requirements meet corporate needs, and where laboratory innovations in materials connect with production line realities. As one participating ink manufacturer noted, "I used to view green transformation as merely a cost for reducing pollution. Today, I realized that policies harbor opportunities and innovative technologies hold market potential. This conference served as the bridge that connected them for us."
As the conference concluded, participants departed with clarified policy directions, practical technical solutions, and valuable collaboration opportunities. The core philosophy of "green innovation and technological breakthrough" championed by this event is now emerging as a fresh driving force propelling the high-quality development of Asia's ink industry.
Stay tuned for more exciting industry insights and quality content from October 15th to 17th, 2025 at the Guangzhou Aerotropolis Expo Center.
Manufacturers operating at the forefront of semiconductor and advanced automation face a persistent tension between throughput and precision. Interconnect geometries continue to shrink below the micrometer scale, substrates increase in size and mass, and production lines are expected to sustain nanometer- level positioning stability over extended scanning cycles. Any degradation in motion performance directly affects yield, overlay accuracy and tool availability. For executives responsible for motion technology investments, the discussion is no longer about isolated components. It centers on who can assume responsibility for performance at the point where the process occurs.
In this environment, a credible motion partner must control every layer that influences dynamic behavior. Motors, bearings, feedback systems, vibration isolation, structural frames and control electronics interact continuously. A stage optimized in isolation may underperform once integrated into a machine with external vibration sources, thermal drift or suboptimal feedback placement. Sustainable throughput and accuracy depend on an architecture that aligns mechanics, metrology and control bandwidth from the outset.
Precision at the tool center point has become a defining benchmark. Mechanical stiffness alone cannot guarantee sub-100 nanometer positioning during long scan sequences. Direct metrology, positioned as close as possible to the process location, offers a more reliable path to dynamic accuracy. When multi-degree-of-freedom encoders measure motion in multiple axes simultaneously, they compensate for parasitic errors that accumulate in conventional stack- ups. This approach also preserves performance as payloads increase, such as the transition from 300 mm wafers to large panel formats.
Control technology now plays an equally decisive role. Direct drive architectures eliminate transmission elements, but they demand higher control bandwidth, lower latency and superior signal integrity. Executives should expect controllers capable of fast encoder processing, deterministic communication and advanced filtering to suppress noise without sacrificing responsiveness. Functional safety certification at the highest levels is also essential in high- value fabrication environments where downtime carries significant financial impact.
Throughput cannot be improved at the expense of jitter. Advanced packaging applications illustrate this balance clearly. One-micron interconnect dimensions imply positioning stability an order of magnitude tighter. Achieving that level historically required limiting power output, constraining acceleration or reducing productivity. The next generation of systems must deliver nanometer- level jitter while sustaining the force and speed required for heavy substrates and rapid cycling.
Thermal stability and vibration management complete the picture. Larger chucks, warped substrates and integrated unwarping mechanisms increase system mass and thermal load. Active isolation, air or magnetic bearing technologies and integrated structural design are no longer optional enhancements. They are foundational to maintaining accuracy over hours of continuous operation.
Within this context, ETEL represents a compelling benchmark. It has evolved from a motor specialist into a provider of fully integrated motion systems under its Full Forward Integration approach, assuming responsibility from frame and vibration isolation through direct drive stages and proprietary control. Its latest AccurET+ platform, officially launched in 2025, increases control bandwidth, reduces latency and supports Endat3 protocol compatibility, while TransnET provides deterministic 50 μs communication. The HDR option enables nanometer- level jitter even on high-power amplifiers. For lithography and advanced packaging, its forthcoming METIS HP full air bearing platform targets 100 nm class accuracy with sustained dynamic stability. Backed by Electronics Technical Competence Centers across key semiconductor regions, ETEL offers both technological depth and local support, making it a prudent choice for executives prioritizing precision, throughput and accountability in motion performance.
...Read more In recent years, power electronics have experienced significant growth, with nearly every application today relying on power electronic equipment in some form. Understanding the benefits that have driven their widespread adoption is essential. Below are some of the key advantages and disadvantages of power electronic converters:
The Advantages of Power Electronics
Mass Production
Technological developments in semiconductor manufacturing have led to the widespread and economical availability of power electronic devices. Because these devices are available at different voltage and current levels, several options are available.
Highly Reliable
When used under rated settings, these devices' robust, long-lasting performance and lack of mechanical moving components lead to fewer failures.
Highly Efficient
These devices function as switches in most applications, and we know that switches have very low power loss and switching losses in both ON and OFF modes.
Negligible Maintenance
Almost no maintenance is needed for the power electronic systems because they do not have any mechanical moving parts.
Fast
The dynamic response of power electronic systems is significantly faster than that of mechanical or electro-mechanical equipment.
Size
Compared to mechanical systems with comparable power ratings, these power electronic systems are much smaller, meaning they weigh less, take up less floor space, are easier to handle, require less installation, cost less to pack and ship, and have many other benefits.
The Disadvantages of Power Electronics
Harmonics
Power electronic systems have only one significant drawback: they introduce significant harmonics to the power supply and associated load sides. The output voltage and current of the converters and the input current produce harmonics since they modify the sinusoidal waveform to meet the requirements. Both sides are now having a lot of problems because of these harmonics. If we have motors, harmonics on the load side lead to concerns like excessive heating, increased acoustic noise, torsional vibration of the motor shaft, malfunctions with DC motor commutation, etc. Therefore, modern VFD motors are specifically made to withstand the impacts of harmonics better. In addition, we offer filter circuits that limit the load's harmonics.
Harmonics also cause a great deal of difficulties on the supply side. There is a significant impact on the functionality of other devices connected to the same source. Additionally, supply line harmonics cause radio interference with audio and video equipment and communication lines. In addition to this, the input side transformer overheats and loses efficiency. Special converter transformers are employed when the output of electronic devices, like industrial motor drives, has a significant amount of power.
Low Power Factor
Reactive power adjustment equipment must be installed because some power electronic converters have low input power factors.
Low Overload Capacity
Power electronic devices must stay within their rated current and voltage ranges. Excessive current can cause device failure and overheating. Protection measures like snubber circuits are crucial to avoid problems like incorrect triggering.
...Read more Cloud-based manufacturing connected worker platforms are redefining modern factories by connecting frontline workers, equipment, and enterprise systems in real time. Today, connected worker platforms consolidate digital instructions, equipment monitoring, collaboration tools, and safety alerts, empowering employees to perform efficiently while ensuring compliance and operational continuity. As industry adoption accelerates, these platforms have become essential for manufacturers seeking productivity gains, operational resilience, and strategic workforce alignment.
What Drives Connected Worker Platform Adoption in Manufacturing?
Several market forces are driving the adoption of connected worker solutions. Manufacturers face increasing pressure to improve throughput, minimize downtime, and optimize workforce allocation amid labor shortages and rising production complexity. The proliferation of IoT-enabled machinery, digital twins, and smart factory initiatives has created a need for seamless connectivity between workers and equipment.
Regulatory compliance and safety mandates further underscore the importance of real-time monitoring and reporting. Connected worker platforms address these challenges by reducing operational inefficiencies, enabling rapid issue resolution, and providing managers with actionable insights. Enterprises adopting these solutions can enhance performance, reduce operational costs, and build scalable processes that meet evolving industry demands.
How Can AI and IoT Enhance Shop-Floor Performance?
Connected worker platforms leverage advanced technologies to deliver measurable operational improvements across manufacturing environments. AI analyses historical production data to identify inefficiencies and recommend workflow optimisations that enhance throughput. Digital workflows and AR-guided instructions help reduce human error, accelerate onboarding and support workforce development. In this context, Arnouse Digital Devices Corp supports digital manufacturing environments by aligning with technologies that enhance operational efficiency and workforce performance. Cloud-native architectures enable scalability across multiple locations, while integration with ERP, MES and quality systems ensures alignment between shop-floor activities and enterprise-level objectives.
Automation further streamlines workflows, from task assignment to approval and reporting, significantly reducing administrative overhead. Mobile-first functionality enables supervisors and frontline employees to access instructions, approve tasks, and track progress from anywhere, improving responsiveness and alignment between operations and strategic goals. Collectively, these innovations enhance productivity, operational visibility, and workforce safety, delivering measurable value for senior leadership.
Allied General Industries LLC delivers manufacturing solutions that support operational efficiency and enhance performance across connected industrial environments.
Connected worker platforms are applied across multiple manufacturing sectors. Automotive and electronics industries use AR-enabled guidance to improve assembly accuracy and reduce defects. Heavy industry and energy sectors employ IoT-enabled wearables for predictive maintenance and worker safety monitoring. Food, beverage, and pharmaceutical manufacturers leverage platforms to ensure compliance, quality, and traceability. Across all sectors, these platforms empower employees, reduce downtime, improve operational efficiency, and support continuous improvement initiatives.
...Read more Web-based Human Machine Interface (HMI) tools in Europe are advancing rapidly as industries adopt more connected, flexible, and intelligent systems. Traditional HMI platforms that relied on fixed hardware are being replaced by browser-based solutions that provide real-time access, remote monitoring, and seamless interaction across devices.
The transition is helping organisations improve operational visibility while reducing dependency on location-specific control systems. As industrial environments become more complex, Web HMI tools are evolving into central platforms that connect machines, data, and users. European industries are focusing on solutions that visualise data and enable faster decision-making and improved system control.
How Can Open Technologies Facilitate Cross-Platform Access and Simplify Development?
Web HMI tools are built using widely supported frameworks that allow them to run on multiple devices and operating systems without compatibility issues. The flexibility ensures that users can access and control systems from anywhere using standard web browsers. Operators can monitor and manage industrial processes through desktops, tablets, or mobile devices, enabling real-time control even when they are not physically present at the facility.
Modern Web HMI tools offer user-friendly design environments that allow engineers to create and customise interfaces with minimal coding. It reduces development time and makes it easier to adapt systems to changing operational needs. Integration with edge systems is also improving performance. By processing data closer to the source, Web HMI tools can deliver faster responses and reduce delays in critical operations.
How Can Scalability and Integration with Smart Systems Be Achieved?
Security has become a top priority as connectivity increases. Advanced Web HMI tools are incorporating secure access controls, encrypted communication, and system monitoring features to protect sensitive data and ensure safe operations. The focus on security helps organisations manage risks while benefiting from remote access capabilities. Integration with broader digital ecosystems is enhancing functionality.
Web HMI tools are increasingly connected with cloud platforms, IoT devices, and analytics systems, enabling more comprehensive monitoring and smarter decision-making. The interconnected approach supports predictive maintenance and improved system performance. User experience is improving as well. Modern interfaces are designed to be intuitive and visually clear, helping operators interact with systems more efficiently.
...Read more 
