The advanced materials industry plays a critical role in the evolution of modern technology. Engineers today face the dual challenge of ensuring electromagnetic compatibility while managing heat dissipation in increasingly compact and high-performance devices. From 5G infrastructure to medical equipment, aerospace applications, and electric vehicles (EVs), the demand for reliable EMI shielding and thermal management solutions continues to grow.

Electromagnetic interference (EMI) can disrupt device functionality, degrade performance, and cause regulatory compliance issues. At the same time, the thermal load in electronic systems has escalated, requiring innovative solutions to prevent overheating and maintain long-term reliability. Engineers must strike a delicate balance between shielding effectiveness, material flexibility, and environmental durability—all while meeting stringent industry regulations such as RoHS, REACH, and UL compliance.

Integrating Shielding and Thermal Management Into the Design Process

One of the biggest challenges in electronic design is ensuring that EMI shielding and thermal management solutions are not afterthoughts but integral to the development process. A reactive approach to these issues can lead to costly redesigns, manufacturing delays, or compromised performance.

Schlegel Electronic Materials (SEM) works closely with design engineers to integrate shielding and thermal solutions early in the design cycle. Engineers don’t have to modify their designs to accommodate standard materials, SEM specializes in developing tailored solutions that fit seamlessly within existing constraints. This collaborative approach enables companies to accelerate product development while maintaining performance, reliability, and compliance.

Material Science Innovations for EMI and Thermal Solutions

SEM’s portfolio of advanced materials includes fabric-over-foam gaskets, conductive elastomers, and gap fillers, and absorbers, each designed to meet the evolving demands of modern electronics.

• Conductive Elastomers: Incorporating materials like silver-plated aluminum or nickel-coated graphite into a silicone base, these solutions offer both EMI shielding and environmental sealing, ensuring protection against moisture, dust, and vibration.

• ORSII: EMI shielding gaskets for Ethernet ports and broadband applications with superior attenuation. Features nickel-copper plated conductive foam and nickel-copper flexible fabric cladding.

• DynaGreen^®: Designed for dynamic, high-shear environments, offering durability and consistent conductivity. Utilizes efficient bump technology to increase contact points, reduce compression force, and maintain shielding performance under repeated motion or vibration.

• Custom Die-Cut Components: For applications requiring precise geometries and low compression force materials, SEM delivers solutions tailored to specific engineering challenges, reducing design constraints and optimizing performance.

• Thermal Management Solutions: As heat dissipation becomes a critical factor in high-power electronics, SEM offers phase-change materials, thermally conductive gaskets, and other solutions to enhance thermal efficiency and system reliability.

Engineering Collaboration: From Concept to Production

A key differentiator in solving complex EMI and thermal challenges is the ability to engage in true engineering collaboration. The Schlegel team takes a hands-on approach, working directly with designers to refine solutions through prototyping, material testing, and real-world validation.

Our TIM and shielding products are built on three core principles: material innovation, application flexibility, and full-cycle support

This iterative process ensures that shielding and thermal solutions align with product performance goals, regulatory requirements, and manufacturing feasibility. By leveraging rapid prototyping capabilities, SEM enables engineers to test and refine designs quickly, reducing uncertainty and accelerating time to market.

“Our role is to bridge the gap between theoretical performance and practical application,” says Haydee Dibble, Vice President of Schlegel Electronic Materials. “By integrating materials expertise with a deep understanding of real-world design challenges, we help engineers develop products that are both technologically advanced and commercially viable.”

Future-Ready Materials and Sustainable Design

As industries push toward greater sustainability, regulatory pressures and environmental considerations are reshaping material selection. SEM is committed to developing shielding solutions that meet these evolving demands, including lead-free, recyclable, and low-VOC (volatile organic compound) materials.

By proactively investing in next-generation materials, SEM helps customers future-proof their designs against shifting regulatory landscapes while ensuring long-term performance and compliance.

Enabling the Next Wave of Electronic Innovation

Innovation in EMI shielding and thermal management is about more than just materials—it’s about engineering solutions that allow technology to advance. SEM partners with design teams to ensure that the next generation of electronics is not only more powerful but also more resilient, efficient, and reliable.

By addressing these critical challenges with a problem-solving mindset, SEM empowers engineers to push the boundaries of design while meeting the demands of today’s complex electronic landscape.