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Manufacturing Technology Insights | Friday, August 27, 2021
CMOS image sensor technology can be used to virtually enhance operations in every industry, from manufacturing and healthcare services to surveillance.
FREMONT, CA: CMOS image sensor (CIS) technological advancements continue to improve the digital imaging environment. While smartphone manufacturers have fuelled demand by utilizing improved photo-taking abilities to set their handsets apart from their competitors, there is also a rising market for applications in the automotive, security, medical, and manufacturing industries.
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The small CMOS image sensors, which are similar in function to the human eye's retina, can now compete with what could previously only be done with enormous, expensive camera equipment. Compared to smartphones, the new applications place an even more significant focus on CIS technological advancement requirements.
CMOS image sensor technology is now gathering data to fuel various new use cases, ranging from driverless vehicles and virtual reality (VR) to next-generation medical imaging and high-tech surveillance systems, rather than simply taking an image for human sight.
How CIS works
At its most primitive form, CMOS image sensor technology is responsible for transforming light from the camera lens into digital data to create an image of the situation in front of it. When visible light energy in the wavelength range of 400 to 700 nm is condensed on the photodiode (PD) of the silicon substrate, the light energy is received by the silicon surface of a CMOS image sensor, forming an electron-hole pair.
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CMOS Image Sensor Manufacturing Techniques
Producing such a complex sensor needs various production techniques that can be divided into a few categories.
Deep PD formation process technology
Consumer expectation for better image quality has sparked a rush to increase pixel density and resolution in mobile CMOS image sensors, expediting CIS process technology production. To get there, the pixel size must be decreased even more to fit more pixels on the same-sized chip.
Pixel-to-pixel isolation process technology
When it comes to high-definition CMOS image sensors, the ability to segregate pixels from one another is critical. Different isolation technologies are used by chipmakers. Using one that isn't as well developed could result in image flaws like color mixing and color spreading.
Wafer stacking process technology
Wafer stacking, or the process of joining two wafers together, is a critical step in producing high-pixel and high-definition CMOS image sensor products. Pixel arrays and logic circuits are created independently on independent wafers for high-pixel CIS products, which are subsequently joined in the middle of the process through a technology known as wafer bonding.
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