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Manufacturing Technology Insights | Thursday, January 19, 2023
Businesses developing the next disruptive electronic device should prioritise an advanced electronics assembly team to ensure a smooth transition from prototype to production.
FREMONT, CA:Today's mobile phones are thin, lightweight devices that fit easily in pockets with features, including calls, a camera, a calculator and calendar, a health tracker, a flashlight, and many more. The marvel of engineering is the reason behind these advancements. People can continually shrink the size and weight of devices while also making them more powerful. This is known as miniaturisation, and there is the use of advanced electronic assembly that makes this possible.
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Miniaturisation in electronic devices involves fitting more transistor nodes on a smaller integrated circuit (IC). The IC is then interfaced within its intended system or device, so once assembled, the system can carry out the desired function. The technology is there, but stronger.
Miniaturisation will change the world, but new advanced manufacturing processes, such as advanced electronics assembly, are needed to address the challenges and adopt the promises of miniaturisation. Whether developing the next system-on-chip or attaching it to a new device, advanced electronics assembly is the masterful combination of know-how, precision, and innovative processes. This makes the device dreamed up by customers in a studio go into mass production and distribution across the world.
Beyond BGAs, another common miniaturisation technique is using wafer-level chip-scale packages. Wafer-level chip scale packages (WLCSPs) are micro-scale ICs assemblable on a wafer that is later diced into individual IC-containing die or chips of a few millimetres in length and width. The connections are made with solid gold joints, either gold wire bonds or gold bumps. These joints maintain their reliability while being as small as 30 microns in diameter, and they can be placed a couple of microns apart.
As the size of transistor nodes decreases, chips can be further downsized without compromising performance. Sometimes their performance can increase as they become smaller. Such nodes enable a more robust system-on-chip (SoC), which can carry out more tasks with better functionality.
Like BGAs, the connections on the IC die are accessed on the underside of the chip, but that can vary by chip design. This flexibility makes IC chips more versatile, but it also makes the advanced electronic assembly process needed to integrate them more intricate. The process required to interface them with their intended devices has become more involved.
Advanced electronics assembly brings research to life by finding ways to fabricate at scale, reducing costs, and leveraging massive engineering expertise. Whether a start-up or a technology leader, to create the next disruptive electronic device, an advanced electronics assembly team helps a seamless transition from prototype to production, irrespective of the size or complexity of electronics.
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