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Manufacturing Technology Insights | Saturday, September 03, 2022
Thermal management applications benefit from additive manufacturing and software tools facilitating heat exchanger design.
FREMONT, CA: Product design is becoming increasingly complicated in nearly all industries, making it harder to manage thermal requirements. It is challenging to manage product temperature appropriately under multiple design constraints. Although engineers have worked hard to overcome these constraints, manufacturing technology limits their abilities. Heat exchanger (HEX) designs can improve by developing computer-aided design (CAD) tools and 3D printing techniques.
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A demonstration of how additive manufacturing and software tools can address traditional thermal management problems can encourage buy-in.
The following trends show software and additive manufacturing combined improves thermal management.
Fuel-cooled oil coolers: Many industrial processing or power generation rigs have heat exchangers that cool engine oil and gearbox oil. Cold fuel can also be preheated using these heat exchangers to increase combustion efficiency.
Off-the-shelf oil coolers are too large or heavy for miniaturized or mobile systems due to size and weight constraints. Engineers can overcome these constraints by developing new heat exchanger designs that decrease the size and mass of heat exchangers while maintaining heat transfer areas.
Conformal cooling: Among the most important design considerations in aerospace applications is weight. Turbine generators in auxiliary power units (APU) produce large amounts of power in small packages. Many aerospace applications depend on these units, and designers are always looking for ways to reduce their weight.
An APU's main constraint is its thermal management. In certain cases, companies have been able to design around this constraint by redesigning the casings of their APU. Engineering teams utilized additive manufacturing and advanced software to develop an entirely new casing design.
Electronics cooling: The reliability of electronic components depends on the ability of engineers to cool them effectively. Cold plates are an effective solution for the thermal management of electronic devices. Heat exchanger size is a persistent issue regarding limiting thermal performance.
Using computational fluid dynamics and thermal analysis, designers can identify the correct flow paths through corresponding channels. Heat exchangers with this optimization have a higher heat transfer coefficient without gaining in overall size.
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